在太尔公司工作了17 年， 其中在加拿大太尔研发中心任职11 年， 领导开发了许多重要工业树脂项目。2004 年后转至太尔中国广东工厂任职， 把太尔在欧美的涂附磨具领域的技术引进到了中国并根据市场的需求进一步完善。
优先号码（）：WO2002US40520 20021219; US20010023827 20011221
Abstract of KR 20040080441 (A)
The present invention is drawn to a composition comprising abrasive particles comprising an organic resin for chemical mechanical planarization (CMP), which can be widely used in the semiconductor industry. The abrasive composition is an aqueous slurry comprising abrasive particles comprising an organic resin, wherein the slurry is held at a pH in the range of 2-12. An attractive feature of the inventive abrasive composition is that it can be tailored to selectively remove different components from the surface. The inventive abrasive composition also provides efficient polishing rates and good surface quality when used in CMP applications.
优先号码（）：US20010821034 20010330; US20000571845 20000516
Abstract of US 2002004554 (A1)
A one-step, in-situ, process for producing a high solids content emulsion or dispersion of partially or totally crosslinked urea formaldehyde (UF), melamine formaldehyde (MF), or melamine urea formaldehyde (MUF) resin droplets or particles, by forming a reaction mixture of (i) aqueous formaldehyde (formalin), (ii) at least one water-soluble protective colloid, (iii) water and (iv) optionally a surfactant, and mixing the reaction mixture in a reaction vessel; optionally adjusting the initial pH of the reaction mixture according to a desired value as needed; adding (i) urea or substituted urea, (ii) melamine or substituted melamine, or (iii) a mixture thereof, to the reaction mixture; and heating the reaction mixture to a temperature at which condensation takes place between the (i) urea or substituted urea, (ii) the melamine or substituted melamine, or (iii) the mixture thereof, and the formaldehyde to form a urea formaldehyde, melamine formaldehyde or melamine urea formaldehyde resin, and holding the reaction mixture at that temperature or a higher temperature, under mixing, for a period of time sufficient to achieve a desired degree of crosslinking in said urea formaldehyde, melamine formaldehyde or melamine urea formaldehyde resin; and cooling the reaction mixture. The droplet or particle size of the resulting resin dispersion can be controlled and adjusted by way of the present technique to the application requirements.
优先号码（）：FI19990000674 19990326; FI19990000675 19990326
Abstract of WO 0058400 (A1)
Method for the manufacture of a colourless or light-coloured phenolic polymer network using upon curing a phenolic resin emulsion and/or dispersion, in which an aldehyde, a phenolic compound and an alkaline catalyst are allowed to react at a temperature of 40-(100 DEG C until a desired degree of condensation is achieved, and the pH of the resin is adjusted to a value below 9 using an acid in the presence of a surface active agent or a mixture of surface active agents at a temperature below the boiling point and a phenolic resin emulsion and/or dispersion is obtained and used as a precursor to give a colourless or light-coloured polymer network when cured. The phenolic resin emulsion and/or dispersion may optionally be spray-dried.
Abstract of WO 0058400 (A1)
A method for the manufacture of a phenolic resin emulsion and/or dispersion, wherein an aldehyde, a phenolic compound and an alkaline catalyst are allowed to react at a temperature of 40 -100.degree.C until a desired degree of condensation is achieved, and the pH of the resin is adjusted to a value below 9 using an acid, at a temperature below 100.degree.C, in the presence of a surface active agent or a mixture of surface active agents. A phenolic resin emulsion and/or dispersion is obtained which provides a colourless or light-coloured glue line or surface when cured.